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  • AP9111R PCB

    AP9111R PCB

    The AP9111R PCB combines the advantages of the rigid characteristics of the rigid circuit board and the bendable characteristics of the flexible board, so that the PCB is no longer a two-dimensional plane layer of oil, but is folded by a three-dimensional internal connection and arbitrary bending. The following is about 12 Layer 8R4F Rigid Flex Board related, I hope to help you better understand 12 Layer AP9111R PCB.
  • Inlaid Copper Coin PCB

    Inlaid Copper Coin PCB

    The Inlaid Copper Coin PCB is inlaid in the FR4, so as to achieve the function of heat dissipation of a certain chip. Compared with ordinary epoxy resin, the effect is remarkable.
  • 5AGXMA5G4F31C5G

    5AGXMA5G4F31C5G

    ​5AGXMA5G4F31C5G is an electronic component produced by Intel (or possibly another brand ALTERA, but it should be noted that it is more common in Intel's product line)
  • XC6VLX550T-3FFG1760C

    XC6VLX550T-3FFG1760C

    ​XC6VLX550T-3FFG1760C is a Virtex-6 series FPGA chip produced by Xilinx. The chip is packaged in FCBGA-1760, with 549888 logic units, supporting up to 1200 user input/output ports, and built-in 23298048 bit memory RAM. Its working power supply voltage range is 0.9V to 1.05V, a
  • Gold finger PCB

    Gold finger PCB

    Gold finger PCB In the extensive use of PCI cable socket gold fingers, gold fingers have been divided into: long and short gold fingers, broken gold fingers, split gold fingers, and gold finger boards. In the process of processing, gold-plated wires need to be pulled. Comparison of conventional gold finger processing processes Simple, long and short gold fingers, the need to strictly control the lead of the gold fingers, requires a second etching to complete.The following is about Gold finger Board related, I hope to help you better understand Gold finger Board.
  • XC7K325T-2FFG900I

    XC7K325T-2FFG900I

    ​XC7K325T-2FFG900I is used to connect to the host system. The 7 series devices utilize Xilinx's unified architecture to protect IP investments and can easily migrate 6 series designs. The unified architecture has universal components, including logic structure, Block RAM, DSP, clock, analog mixed signal (AMS), and fast target changing within the 7 series. The Kindex-7 FPGA architecture greatly shortens development time, allowing designers to focus on product differentiation and new projects for migration.
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  • What skills are required for PCB proofing

    At present, many PCB proofing companies have established relatively complete test methods, test standards, various test equipment and instruments to detect and identify the qualification and service life of Allegro proofing products. PCB products are not only convenient for standardized assembly of various components, but also for automatic and large-scale mass production. Therefore, PCB proofing with reliable quality has outstanding advantages. So what skills do you need to master to ensure that the PCB proofing work is more outstanding?

  • 5 major causes and solutions for PCB surface mount soldering

  • PCB design principles

    To get the best performance from electronic circuits, the layout of components and the layout of wires are important.

  • Development of integrated circuits

    The most advanced integrated circuit is the core of microprocessor or multi-core processor, which can control everything from computer to mobile phone to digital microwave oven. Although the cost of designing and developing a complex

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • Is Semiconductor Spring Coming? What is the current situation and future development trend of the industry?

    Recently, the semiconductor industry has received much attention. Morgan Stanley recently released a report stating that the deflation of the technology industry, coupled with long-term demand for artificial intelligence semiconductors, will trigger the next industry upward cycle for logic semiconductors. This news has inspired the semiconductor industry, and some people believe that the spring of semiconductors is not far away. So, let's analyze the current situation and future of the semiconductor industry.

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