What is an HDI (High Density Interconnect) PCB?

High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Due to the continuous development of technology and the electrical requirements for high-speed signals, the circuit board must provide impedance control with AC characteristics, high-frequency transmission capability, and reduce unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. In order to meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.

It adopts a modular parallel design, one module has a capacity of 1000VA (1U height), natural cooling, and can be directly put into a 19" rack, and can be connected in parallel with 6 modules. The product adopts full digital signal processing (DSP) technology and multiple A patented technology, it has the ability to adapt to the load in a full range and has a strong short-time overload capability, and the load power factor and crest factor can be ignored.