VIA in PAD PCB Manufacturers

It adheres for the tenet "Honest, industrious, enterprising, innovative" to develop new products and solutions continuously. It regards shoppers, success as its individual success. Let us produce prosperous future hand in hand for VIA in PAD PCB,Megtron6 PCB,Megtron6 high speed PCB,Hard gold PCB,Cross blind buried via PCB, The team of our company along with the use of cutting-edge technologies delivers impeccable top quality products supremely adored and appreciated by our shoppers worldwide.
VIA in PAD PCB, With the effort to keep pace with world's trend, we are going to always endeavor to meet customers' demands. If you want develop any other new products and solutions, we can customize them in your case. If you feel interest in any of our goods or want develop new merchandise, remember to feel free to contact us. We're looking forward to forming successful business relationship with customers all over the world.

Hot Products

  • FR-5 PCB

    FR-5 PCB

    FR-5 PCB epoxy board is made of special electronic cloth soaked with epoxy phenolic resin and other materials by high temperature and high pressure hot pressing. It has high mechanical and dielectric properties, good insulation, heat and moisture resistance, and good machinability
  • TPS5410MDREP

    TPS5410MDREP

    TPS5410MDREP is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-1FFG1158I

    XC7VX690T-1FFG1158I

    XC7VX690T-1FFG1158I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-2FLGB2104I

    XCVU190-2FLGB2104I

    ​XCVU190-2FLGB2104I Virtex ® UltraScale FPGAs: High capacity, high-performance FPGAs implemented using single-chip and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance by integrating various system level functionalities to meet critical market and application requirements.
  • 10CX105YF672E6G

    10CX105YF672E6G

    10CX105YF672E6G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM53426A0KFSBG

    BCM53426A0KFSBG

    BCM53426A0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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