Flexible Printed Circuit board Manufacturers

Our items are commonly identified and trusted by people and can fulfill repeatedly altering economic and social wants of Flexible Printed Circuit board,FPC flexible board,FPC flexible circuit board,FPC,FPC soft board, We generally concertrating on creating new creative item to meet request from our clients everywhere in the world. Be a part of us and let's make driving safer and funnier alongside one another!
Flexible Printed Circuit board, We pursue the management tenet of "Quality is superior, Service is supreme, Reputation is first", and will sincerely create and share success with all clients. We welcome you to contact us for more information and look forward to working with you.

Hot Products

  • EP1C6F256C8N

    EP1C6F256C8N

    EP1C6F256C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX260FF35C4N

    EP2AGX260FF35C4N

    ​EP2AGX260FF35C4N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 260,000 Logic Elements, operates at a speed of up to 800 MHz, and features 30.8 Mb of embedded memory, 1,152 DSP blocks, and 24 high-speed transceiver channels.
  • LTC6804IG-1#TRPBF

    LTC6804IG-1#TRPBF

    LTC6804IG-1#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB is pressed 3-6 layers first, then 2 and 7 layers are added, and finally 1 to 8 layers are added, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XC6SLX4-3CPG196I

    XC6SLX4-3CPG196I

    XC6SLX4-3CPG196I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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