Multilayer PCB Manufacturers

As for aggressive rates, we believe that you will be searching far and wide for anything that can beat us. We can easily state with absolute certainty that for such good quality at such charges we are the lowest around for Multilayer PCB,Impedance control PCB,Hard gold PCB,Super thick PCB,Ultra-thin PCB, We could customize the goods according to your needs and we will pack it for you personally when you get.
Multilayer PCB, We care about every steps of our services, from factory selection, product development & design, price negotiation, inspection, shipping to aftermarket. We have implemented a strict and complete quality control system, which ensures that each product can meet quality requirements of customers. Besides, all of our products have been strictly inspected before shipment. Your Success, Our Glory: Our aim is to help customers realize their goals. We are making great efforts to achieve this win-win situation and sincerely welcome you to join us.

Hot Products

  • EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10AX027H3F35E2SG

    10AX027H3F35E2SG

    10AX027H3F35E2SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150T-N3FGG676I

    XC6SLX150T-N3FGG676I

    ​XC6SLX150T-N3FGG676I is a high-performance FPGA chip with a wide range of applications, including communication, data centers, image processing, and radar systems. This chip has high performance and flexibility, and can achieve high-speed signal processing
  • XC18V04VQG44C

    XC18V04VQG44C

    XC18V04VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • H800-865K-A1

    H800-865K-A1

    H800-865K-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2S30F672I4N

    EP2S30F672I4N

    EP2S30F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

Send Inquiry