High-Density Interconnect (HDI) PCBs enable revolutionary advancements in electronics by packing intricate circuitry into compact designs. As a leader in HDI PCB manufacturing, HONTEC delivers demanding precision-edge solutions for industries demanding precision, reliability, and rapid innovation. With certifications including UL, SGS, and ISO9001, and streamlined logistics via UPS/DHL, we empower cutting clients across 28 countries. Below, we explore HDI PCB applications, technical specifications, and industry-specific benefits.
BCM89551B1BFBGT is a high-performance automotive Ethernet switch chip launched by Broadcom, which plays a key role in today's intelligent devices.
In different application scenarios, high-speed board design needs to closely fit its core functions and physical limitations, showing obvious differentiated emphasis.
As an indispensable core component in modern electronic devices, HDI boards (high-density interconnect boards) are widely used in multiple technology-intensive fields due to their high precision, high integration and high reliability.
As an important electronic component carrier, double-sided boards have been widely used in modern electronic devices due to their unique double-layer wiring structure.
As a key component in modern electronic devices, high-speed boards are widely used in communication, computing, consumer electronics, and industrial control.
