STM32F439ZIT6 integrated circuits, processors, microcontrollers ST/ST Semiconductor Package LQFP-144
L7986ATR power management chip ST / STMicroelectronics package SOP-8 patch foot L7986A new switching regulator 3A DC 4.5 38V 250kHz
IC carrier: generally, it is a board on the chip. The board is very small, generally, it is 1/4 nail cover size, and the board is very thin 0.2-0. The material used is FR-5, BT resin, and its circuit is about 2mil / 2mil. For high-precision boards, it used to be produced in Taiwan, but now it is developing to the mainland.
Industrial control PCBA generally refers to a processing flow, which can also be understood as the finished circuit board, that is, PCBA can only be counted after the processes on the PCB are completed. PCB refers to an empty printed circuit board with no parts on it.
Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
