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Hot Products

10AX048H4F34E3SG
10AX048H4F34E3SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
KSZ9031RNXIA-TR
KSZ9031RNXIA-TR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EP2AGX95EF29I3G
EP2AGX95EF29I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
IMX662-AAQR
IMX662-AAQR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCVU9P-2FLGC2104I
XCVU9P-2FLGC2104I (note: in search results, XCVU9P-2FLGA2104I or XCVU9P-2FLGB2104I are more common, but I will answer based on the model you provided and assume it may be a specific version or a typo) may be an FPGA (Field Programmable Gate Array) chip in Xilinx's Virtex UltraScale+series
GA102-850-A1
GA102-850-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Manufacturing process of printed circuit board
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What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States
The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.
China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?
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The Development History of Semiconductors
Semiconductor is the foundation of modern electronic technology, and its development can be traced back to the late 19th century. This article will introduce the development history of semiconductors and explore their importance to modern technology.
Design steps of multilayer circuit board
The Function and Principle of Chips
The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.

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10 layer 3Step HDI PCB 10layers 3Step HDI PCB 12 layer 3Step HDI PCB 12-layer copper paste plug PCB 12-layer IC test PCB 14layer 4step HDI PCB 14-layer 4step HDI PCB 15Step HDI PCB 16-layer 2step HDI PCB 16-layer 2step HDI Rigid-Flex PCB 16layer 5step HDI PCB 16-layer copper paste plug hole PCB 16-layer IC test board 18 layers copper paste plug hole PCB 18-layer 5step HDI circuit board 1ST280EU1F50I1VG 1ST280EU2F50E2LG 1ST280EU3F50I3VG 20-layer 6step HDI PCB 22 layers of 3step HDI PCB 24layer 4step HDI PCB 26 layers of 2step HDI PCB 2step HDI optical module PCB 2Step HDI PCB 2-step HDI PCB 2step HDI Rigid-Flex PCB 32-layer 3step HDI PCB 3step HDI optical module PCB 3step HDI PCB 3-step HDI PCB 3step HDI Rigid-Flex PCB 4Step HDI PCB 4-step HDI PCB 5CSTFD6D5F31I7N 5G test PCB 5step HDI PCB 5-step HDI PCB 6-layer 1step HDI Rigid-Flex PCB 6-layer 2step HDI PCB 6-layers 2Step HDI PCB 6step HDI PCB 6-step HDI PCB 7step HDI PCB 7-step HDI PCB 8 layer 2Step HDI PCB 8-layer 2-step drone HDI PCB 8-layer 2step HDI Rigid-Flex PCB 8-layer 3Step HDI PCB 8layers 2Step HDI PCB 8layers 3Step HDI PCB 8step HDI PCB 8-step HDI PCB 9step HDI PCB AD1938WBSTZ AD1940YSTZ AD7606BSTZ AD7606BSTZ-4 AD7607BSTZ AD7610BSTZ AD7616BSTZ AD7653ASTZ AD7656BSTZ-1 AD7656YSTZ AD7656YSTZ-1 AD7674ASTZ AD9751ASTZ AD9857ASTZ AD9880KSTZ-150 ADAU1701JSTZ ADV7495BBSTZ-170 Astra MT77 PCB ATE Test PCB Brand: xilinx Operating temperature: -40℃ ~ 100℃ Number of stitches: 2104 Buried resistor PCB CAF resistant PCB copper paste filled hole PCB copper paste filled via PCB copper paste filling hole PCB copper paste PCB Copper paste plug hole PCB EM-LXE High temperature resistant PCB EPM7128STC100-10 HI-1573PST HI-1574PST HI-1579PST HI-8445PST HI-8482PST HI-8482ST HI-8570PST HI-8586PST HI-8588PST HI-8591PST HI-8596PST HI-8596PSTF HI-8597PST HI-8597PSTF HI-8598PSTF HI-8684PST High frequency step PCB high heat resistant PCB High-frequency step board High-frequency step PCB Hl-8596PSTF Ic substrate Industrial control PCBA Industrial Heavy Copper PCB IT150GSTC PCB Megtron6 step High-speed PCB Megtron6 step PCB Microstrip PCB Model number Hi-1573 PSI, Brand: Holt Integrated Circuits Package: SO, SOIC(EP) Lot number: 2022+ Patch installation Bonding installation ESOIC-20 Differential 3.45V 3.15V 12.79mm*7.49mm*2.29mm multilayer Buried resistance PCB Rogers Step PCB RT5870 microstrip PCB RT5880 microstrip PCB RT5880 step PCB RT6006 microstrip PCB SH260 high heat-resistant PCB Solid State Disk PCB Solid State Drive PCB ST115D high thermal conductivity PCB ST115D PCB ST115G PCB Step high frequency PCB step PCB STM32F042C6T6 STM32F051K8U6TR STM32F103RBT6TR STM32F103RCT6TR STM32F103ZET7 STM32F407VET6TR STM32F411CEU6TR STM32F415RGT6 STM32F427IIT7 STM32F439ZIT6 STM32F745ZGT6 STM32F746NGH6 STM32G473MEY6 STM32G474MEY6 STM32L162RDT6 STMicroelectronics

ST Manufacturers

Related Products

Hot Products

10AX048H4F34E3SG

KSZ9031RNXIA-TR

EP2AGX95EF29I3G

IMX662-AAQR

XCVU9P-2FLGC2104I

GA102-850-A1

Manufacturing process of printed circuit board

What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?

The Development History of Semiconductors

Design steps of multilayer circuit board

The Function and Principle of Chips

Joanne 2020-06-18 15:32:38

Anna 2021-11-01 07:24:52

Henry 2022-10-16 11:32:04

Rose 2021-07-23 04:05:39

Amber 2023-01-06 07:31:46

King 2021-09-19 00:02:48

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.