22 layers of 3step HDI PCB Manufacturers

Sticking to the principle of "Super Good quality, Satisfactory service" ,We are striving to become an excellent organization partner of you for 22 layers of 3step HDI PCB,24 layers ELIC HDI PCB,26 layers of 2step HDI PCB, Our goal is always to enable clients comprehend their plans. We have been creating good endeavours to accomplish this win-win scenario and sincerely welcome you to join us.
22 layers of 3step HDI PCB, Each year, many of our customers would visit our company and achieve great business advancements working with us. We sincerely welcome you to visit us at any time and together we will prevail to a greater success in the hair industry.

Hot Products

  • XC7K160T-1FBG676I

    XC7K160T-1FBG676I

    XC7K160T-1FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU440-1FLGA2892C

    XCVU440-1FLGA2892C

    XCVU440-1FLGA2892C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M50DAF256I7G

    10M50DAF256I7G

    10M50DAF256I7G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8282APJI

    HI-8282APJI

    HI-8282APJI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • S1D13700F02A100

    S1D13700F02A100

    S1D13700F02A100 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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