10 layer 3Step HDI PCB Manufacturers

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Hot Products

  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
  • STM32F042C6T6

    STM32F042C6T6

    STM32F042C6T6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-5FTG256C

    XC3S1000-5FTG256C

    ​XC3S1000-5FTG256C is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Spartan series. This product has the following features and specifications:
  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
  • MT46H16M32LFB5-5IT:C

    MT46H16M32LFB5-5IT:C

    ​MT46H16M32LFB5-5IT:C is a type of synchronous dynamic random-access memory (SDRAM) module manufactured by Micron Technology. It has a capacity of 512 megabytes and operates at a frequency of 400 megahertz.
  • HI-35930PQTF

    HI-35930PQTF

    HI-35930PQTF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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