6-layer 2step HDI PCB Manufacturers

Our pursuit and company goal is to "Always satisfy our customer requirements". We continue to develop and design superior quality products for both our old and new customers and achieve a win-win prospect for our clients as well as us for 6-layer 2step HDI PCB,14-layer 4step HDI PCB,16-layer 2step HDI PCB, Never-ending improvement and striving for 0% deficiency are our two main good quality policies. Should you need anything, do not hesitate to call us.
6-layer 2step HDI PCB, We always stick to the tenet of "sincerity, high quality, high efficiency, innovation". With years of efforts, we have established friendly and stable business relationships with worldwide customers. We welcome any of your inquiries and concerns for our merchandise, and we have been sure that we'll supply just what you want, as we always believe that your satisfaction is our success.

Hot Products

  • XCAU10P-1FFVB676E

    XCAU10P-1FFVB676E

    ​XCAU10P-1FFVB676E is an Artix produced by AMD ® The UltraScale+series FPGA (Field Programmable Gate Array) chips are packaged in BGA-676 format. This chip features high performance, low power consumption, and high customizability, making it suitable for various high-performance application scenarios. The specific parameters of XCAU10P-1FFVB676E include:
  • MT40A1G16TB-062EIT:F

    MT40A1G16TB-062EIT:F

    ​MT40A1G16TB-062EIT:F is a type of memory module commonly used in computer systems. It is a 1GB DDR3 SDRAM module manufactured by Micron Technology
  • XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture). Processing System (PS) and Xilinx Programmable Logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • XC3S1500L-4FGG320C

    XC3S1500L-4FGG320C

    XC3S1500L-4FGG320C ​Number of Logic Components: Based on the characteristics of the Spartan-3 series, this model may contain thousands to tens of thousands of logic components, but specific values need to be referred to in the data manual
  • XC6SLX9-3CSG225C

    XC6SLX9-3CSG225C

    XC6SLX9-3CSG225C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2SGX130GF1508I4N

    EP2SGX130GF1508I4N

    EP2SGX130GF1508I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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