Products
Home > Products > HI-1573PST

HI-1573PST Manufacturers

To become the stage of realizing dreams of our employees! To build a happier, more united and extra professional workforce! To reach a mutual advantage of our prospects, suppliers, the society and ourselves for HI-1573PST, We have been also the appointed OEM factory for several worlds' famous merchandise brands. Welcome to speak to us for more negotiation and cooperation.
HI-1573PST, For many years, we now have adhered to the principle of customer oriented, quality based, excellence pursuing, mutual benefit sharing. We hope, with great sincerity and good will, to have the honor to help with your further market.

Related Products

Hot Products

  • XCVU29P-2FSGA2577I

    XCVU29P-2FSGA2577I

    ​XCVU29P-2FSGA2577I is an electronic component from Xilinx, specifically part of the UltraScale+FPGA (Field Programmable Gate Array) series. The following is a detailed introduction to XCVU29P-2FSGA2577I:
  • XCKU5P-2FFVA676I

    XCKU5P-2FFVA676I

    XCKU5P-2FFVA676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5M1270ZF256I5N

    5M1270ZF256I5N

    5M1270ZF256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM43341XKUBG

    BCM43341XKUBG

    BCM43341XKUBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1S10F780C7N

    EP1S10F780C7N

    EP1S10F780C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX75-3FGG676I

    XC6SLX75-3FGG676I

    XC6SLX75-3FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • What are the advantages of double-sided board applications?

    As an important electronic component carrier, double-sided boards have been widely used in modern electronic devices due to their unique double-layer wiring structure.

  • What is a chip

    Definition: An integrated circuit chip is a small, thin silicon-based material that integrates electronic components such as transistors, resistors, capacitors, etc. It is a fundamental component of electronic devices.

  • Semiconductor refrigeration technology

    Semiconductor refrigeration technology is widely used in the current refrigeration technology. During the growth of crops in the greenhouse, semiconductor refrigeration technology can effectively control the environmental temperature, especially for some plants with high requirements for the environment

  • This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history

    According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • Polar models flexible PCB enhanced resistance

    Now Si8000m and Si9000e also have a new option of XFE cross-modeling function, which Polar Instruments can provide. More than 98% of PCB manufacturers including Hongtai use Polar.​

Send Inquiry