Laser Blind Buried Hole PCB Manufacturers

We believe that prolonged time period partnership is really a result of top of the range, benefit added provider, prosperous knowledge and personal contact for Laser Blind Buried Hole PCB,Cross Blind Buried Hole PCB,4-layer via-in-PAD PCB,VIA-in-PAD PCB,VIA in PAD PCB, we could solve our customer problems asap and do the profit for our customer. For those who need superior provider and excellent , pls choose us , thanks !
Laser Blind Buried Hole PCB, Our company now has many department, and there have more than 20 employees in our company. We set up sales shop, show room, and product warehouse. In the meantime, we registered our own brand. We have tightened inspection for quality of product.

Hot Products

  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MT40A1G8SA-062E:E

    MT40A1G8SA-062E:E

    MT40A1G8SA-062E:E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S50-4PQG208C

    XC3S50-4PQG208C

    XC3S50-4PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C10F256I7N

    EP3C10F256I7N

    EP3C10F256I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-2FF900I

    XC7K325T-2FF900I

    ​XC7K325T-2FF900I FPGA integrated circuit XC7K325T-2F900I 640MHz Kintex-7 FPGA chip 900-FCBGA
  • BCM68621B0IFSBG

    BCM68621B0IFSBG

    BCM68621B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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