4-layer via-in-PAD PCB Manufacturers

Our primary intention should be to offer our clientele a serious and responsible enterprise relationship, delivering personalized attention to all of them for 4-layer via-in-PAD PCB,Cross Blind Buried Hole PCB,Laser Blind Buried Hole PCB,VIA-in-PAD PCB,VIA in PAD PCB, We're seeking forward to forming successful business enterprise romantic relationship with new shoppers in the around upcoming!
4-layer via-in-PAD PCB, With many years good service and development, we've a professional international trade sales team. Our products and solutions have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. Looking forward to build up a good and long term cooperation with you in coming future!

Hot Products

  • TPS54678RTET

    TPS54678RTET

    TPS54678RTET is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • SN74CBTLV1G125DCKR

    SN74CBTLV1G125DCKR

    SN74CBTLV1G125DCKR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM50991ELB0KFEBG

    BCM50991ELB0KFEBG

    BCM50991ELB0KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX190EF29I5G

    EP2AGX190EF29I5G

    ​The EP2AGX190EF29I5G Arria ® II GX EP2AGX190EF29I5G FPGA provides stronger functionality for applications based on 6G transceivers.
  • XAZU4EV-1SFVC784Q

    XAZU4EV-1SFVC784Q

    XAZU4EV-1SFVC784Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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