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Hot Products

  • XC7K410T-3FFG900E

    XC7K410T-3FFG900E

    ​XC7K410T-3FFG900E is a user configurable analog interface (XADC) that integrates dual 12 bit 1MSPS analog-to-digital converters with on-chip thermal and power sensors.
  • 5G Optical Module PCB

    5G Optical Module PCB

    10G SFP+ LR is a high performance, cost effective modules, which is supporting Multi Rate 2.4576Gbps to 10.3125Gbps, and transmission distance up to 10km on SM fiber. The transceiver consists of two sections: The transmitter section incorporates a laser driver and a 1310nm DFB laser.The following is about 5G Optical Module PCB related, I hope to help you better understand 5G Optical Module PCB.
  • XC6VLX550T-2FFG1759C

    XC6VLX550T-2FFG1759C

    XC6VLX550T-2FFG1759C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, which belongs to the LXT sub series of the Virtex-6 series. Here is a detailed introduction to the chip:
  • EP3SE110F1152I3N

    EP3SE110F1152I3N

    EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A200T-2SBG484C

    XC7A200T-2SBG484C

    ​XC7A200T-2SBG484C is a high-performance FPGA chip produced by Xilinx. This chip plays a crucial role in multiple application scenarios due to its powerful functionality and flexibility. Here are some detailed introductions about XC7A200T-2SBG484C:
  • XCKU3P-1FFVD900E

    XCKU3P-1FFVD900E

    ​XCKU3P-1FFVD900E is an FPGA chip launched by Xilinx, belonging to the Kintex UltraScale+series. This chip adopts a 20 nanometer process and has highly integrated characteristics, which can be widely used in high-performance computing, video processing

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