48-layer back-drilled PCB Manufacturers

Our pursuit and corporation intention is to "Always satisfy our client requirements". We continue to develop and style remarkable high-quality items for each our outdated and new shoppers and accomplish a win-win prospect for our customers likewise as us for 48-layer back-drilled PCB,28-layer cross blind buried hole PCB,40-layers 6.4MM thick PCB, Welcome to setup long-term romantic relationship with us. Best Value Permanently Top quality in China.
48-layer back-drilled PCB, Now we have constructed strong and long co-operation relationship with an enormous quantity of companies within this business overseas. Immediate and professional after-sale service supplied by our consultant group has happy our buyers. In depth Info and parameters from the merchandise will probably be sent to you for any thorough acknowledge. Free samples may be delivered and company check out to our corporation. n Portugal for negotiation is constantly welcome. Hope to get inquiries type you and construct a long-term co-operation partnership.

Hot Products

  • XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-2FLGB2104I

    XCVU13P-2FLGB2104I

    XCVU13P-2FLGB2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTM4649IY#PBF

    LTM4649IY#PBF

    LTM4649IY#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEFA7U19I7N

    5CEFA7U19I7N

    ​5CEFA7U19I7N is an FPGA field programmable logic device, and Cyclone ® V devices can simultaneously meet the requirements of decreasing power consumption, cost, and time to market, as well as the increasing bandwidth requirements of large-scale and cost sensitive applications.
  • 5AGZME1H2F35I3N

    5AGZME1H2F35I3N

    5AGZME1H2F35I3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-2FFVD900I

    XCKU3P-2FFVD900I

    ​XCKU3P-2FFVD900I is an electronic component produced by Xilinx, available in BGA packaging with batch numbers 21+and 22+. This component belongs to the FPGA (Field Programmable Gate Array) category and is suitable for various electronic devices and systems.

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