28-layer cross blind buried hole PCB Manufacturers

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Hot Products

  • XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K410T-2FFG900I

    XC7K410T-2FFG900I

    ​XC7K410T-2FFG900I has optimized the best cost performance ratio, doubling compared to the previous generation, achieving a new class of FPGA.
  • XCZU43DR-1FFVE1156I

    XCZU43DR-1FFVE1156I

    XCZU43DR-1FFVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU11EG-2FFVC1760E

    XCZU11EG-2FFVC1760E

    XCZU11EG-2FFVC1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 98,304 logic cells, 4.9 Mb of distributed RAM, 240 Digital Signal Processing (DSP) slices, and 8 clock management tiles. It requires a power supply of 1.2V to 1.5V and supports various I/O standards such as LVCMOS, LVDS, and PCI Express.

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