Products
Home > Products > XCZU17EG-2FFVB1517E

XCZU17EG-2FFVB1517E Manufacturers

With this motto in mind, we've turn into one of quite possibly the most technologically innovative, cost-efficient, and price-competitive manufacturers for XCZU17EG-2FFVB1517E, We have been sincerely wanting forward to cooperate with consumers all over the earth. We feel we can easily satisfy with you. We also warmly welcome buyers to visit our manufacturing unit and purchase our products and solutions.
XCZU17EG-2FFVB1517E, We focus on providing service for our clients as a key element in strengthening our long-term relationships. Our continual availability of high grade solutions in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. We have been willing to cooperate with business friends from at home and abroad and create a great future together.

Related Products

Hot Products

  • BCM54991EB0IFSBG

    BCM54991EB0IFSBG

    BCM54991EB0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S500E-4FTG256I

    XC3S500E-4FTG256I

    XC3S500E-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM47722EA1KFEBG

    BCM47722EA1KFEBG

    BCM47722EA1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A200T-L2SBG484E

    XC7A200T-L2SBG484E

    XC7A200T-L2SBG484E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • B50280C1KFBG

    B50280C1KFBG

    B50280C1KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S75-1FGGA484C

    XC7S75-1FGGA484C

    Xilinx XC7S75-1FGGA484C Spartan ® -7 Field Programmable Gate Array adopts MicroBlaze with operating frequency exceeding 200DMIP ™ Soft processor, supporting 800Mb/s DDR3, based on 28nm technology. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • Related Blog
  • Reviews

  • How to design a PCB for high frequency?

    Designing a PCB (Printed Circuit Board) for high-frequency applications requires careful consideration of various factors to ensure signal integrity, minimize losses, and mitigate electromagnetic interference. Here are some key steps and considerations:

  • The introduction of the high speed board

    HONTEC is one of leading High-speed Board manufacture, who specializes in high-mix,low volume and quickturn prototype PCB for high-tech industries in 28 countries.(China high speed board）

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • Main Classification of Chips

    According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.

  • Characteristics of semiconductors

    Semiconductor has the following characteristics: dopability, thermal sensitivity, photosensitivity, negative resistivity temperature, and rectifiability.

  • Where are HDI boards mainly used?

    As an indispensable core component in modern electronic devices, HDI boards (high-density interconnect boards) are widely used in multiple technology-intensive fields due to their high precision, high integration and high reliability.

Send Inquiry