When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible.
Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCB, which can handle thermal stress.
It is in the interests of
heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.
Since the overheating of electronic components can lead to failures and even life-threatening, hazard management cannot be ignored.
The traditional process to achieve heat dissipation quality is to use external heat sinks, which are connected and used together with heat generating components. Since the heat-generating parts are close to high temperature if they do not dissipate heat, in order to dissipate this heat, the radiator consumes heat from the parts and transfers it to the surrounding environment. Usually, these heat sinks are made of copper or aluminum. The use of these radiators not only exceeds the development cost, but also requires more space and time. Although the result is not even close to the heat dissipation capacity of
heavy copper PCB.
In heavy copper PCB, the heat sink is printed on the circuit board during the manufacturing process instead of using any external heat sink. Since the external radiator requires more space, there are fewer restrictions on the placement of the radiator.
Since the heat sink is plated on the circuit board and connected with the heat source using conductive through holes instead of any interfaces and mechanical joints, the heat is transferred quickly, thereby improving the heat dissipation time.
Compared with other technologies, the heat dissipation vias in
heavy copper PCB can achieve more heat dissipation because the heat dissipation vias are developed with copper. In addition, the current density is improved and the skin effect is minimized.
