XCVU5P-3FLVB2104E Manufacturers

We now have several exceptional workers customers good at marketing, QC, and working with types of troublesome trouble during the creation system for XCVU5P-3FLVB2104E, When you are hunting once and for all Top quality at a great price tag and timely delivery. Do make contact with us.
XCVU5P-3FLVB2104E, We believe in establishing healthy customer relationships and positive interaction for business. Close cooperation with our customers has helped us to create strong supply chains and reap benefits. Our products and solutions have gained us widespread acceptance and the satisfaction of our worldwide valued clients.

Hot Products

  • 10M02SCU169C8G

    10M02SCU169C8G

    ​10M02SCU169C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip has non-volatile characteristics, built-in dual configuration flash memory and user flash memory, and supports instant configuration. It integrates an analog-to-digital converter (ADC) and a single-chip Nios II soft core processor, suitable for various applications such as system management, I/O expansion, and storage
  • DS3231MZ+TRL

    DS3231MZ+TRL

    DS3231MZ+TRL is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX290NF45C3N

    EP4SGX290NF45C3N

    EP4SGX290NF45C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • RO3010 PCB

    RO3010 PCB

    RO3010 PCB Laminate twice. Take an eight-layer circuit board with blind/buried vias as an example. First, laminate layers 2-7, first make elaborate blind/buried vias, and then laminate layer 1 and 8 layers to make well-made vias .The following is about6 layers 2Step HDI, I hope to help you better understand RO3010 PCB
  • XC2VP40-5FF1152I

    XC2VP40-5FF1152I

    XC2VP40-5FF1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XA6SLX45-2CSG324Q

    XA6SLX45-2CSG324Q

    XA6SLX45-2CSG324Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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