XCVU5P-1FLVB2104I Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for XCVU5P-1FLVB2104I, If you're interested in any of our products and services, make sure you don't be reluctant to call us. We've been wanting to reply you within 24 several hours just after receipt of your respective ask for and to generate mutual un-limited positive aspects and enterprise in in the vicinity of long run.
XCVU5P-1FLVB2104I, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Hot Products

  • XCF02SVOG20C

    XCF02SVOG20C

    XCF02SVOG20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • XC7S50-2CSGA324C

    XC7S50-2CSGA324C

    XC7S50-2CSGA324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4CE30F23C8N

    EP4CE30F23C8N

    EP4CE30F23C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • N9000-13RF PCB

    N9000-13RF PCB

    N9000-13rf PCB is a RF substrate developed by nelco company in Singapore. It is FR4 and easy to process. Its application field is usually communication industry

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