XCKU095-1FFVB1760C Manufacturers

continue on to improve, to be sure product or service high quality in line with market and consumer standard prerequisites. Our firm has a high-quality assurance program are established for XCKU095-1FFVB1760C, To supply prospects with superb equipment and providers, and constantly build new machine is our company's organization objectives. We look ahead for your cooperation.
XCKU095-1FFVB1760C, Our continual availability of high grade products in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!

Hot Products

  • Multilayer PCB circuit board

    Multilayer PCB circuit board

    Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.
  • XC4VSX35-11FF668C

    XC4VSX35-11FF668C

    ​XC4VSX35-11FF668C is a Virtex-4 series FPGA chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include supporting rich logical units and I/O resources,
  • XCZU42DR-L2FSVE1156I

    XCZU42DR-L2FSVE1156I

    XCZU42DR-L2FSVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115H3F34I2SG

    10AX115H3F34I2SG

    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
  • EPM7128SQI100-10N

    EPM7128SQI100-10N

    EPM7128SQI100-10N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX980T-1FFG1926C

    XC7VX980T-1FFG1926C

    XC7VX980T-1FFG1926C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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