XC7S100-2FGGA484C Manufacturers

we can easily provide top quality solutions, competitive value and best client company. Our destination is "You come here with difficulty and we provide you a smile to take away" for XC7S100-2FGGA484C, Our ultimate objective is always to rank as a top brand also to lead as a pioneer inside our field. We're sure our prosperous experience in tool generation will gain customer's trust, Wish to co-operate and co-create an even better upcoming with you!
XC7S100-2FGGA484C, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which might be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we will continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Hot Products

  • XC6VLX240T-2FFG1759C

    XC6VLX240T-2FFG1759C

    XC6VLX240T-2FFG1759C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • HI-1573PSI

    HI-1573PSI

    HI-1573PSI Category: LIN transceiver Brand: HOLT INTEGRATED CIRCUITS Package: SO, SOIC(EP) Description: Wire mounting bracket mounting patch Mounting SO SOIC(EP)
  • XC7Z045-2FFG676I

    XC7Z045-2FFG676I

    ​XC7Z045-2FFG676I is a high-performance SoC (System on Chip) FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Zynq-7000 series
  • BCM88270CA1IFSBG

    BCM88270CA1IFSBG

    BCM88270CA1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FLGA2577E

    XCVU13P-2FLGA2577E

    ​XCVU13P-2FLGA2577E Virtex™ UltraScale+ ™ The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • XC3S200A-4VQG100C

    XC3S200A-4VQG100C

    XC3S200A-4VQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry