XC7K325T-2FF900I Manufacturers

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Hot Products

  • XCVU13P-3FIGD2104E

    XCVU13P-3FIGD2104E

    ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.
  • XC3S500E-4FTG256I

    XC3S500E-4FTG256I

    XC3S500E-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU15P-2FFVA1156E

    XCKU15P-2FFVA1156E

    ​Xilinx XCKU15P-2FFVA1156E Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • 24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB--When a printed circuit board is made into a final product, integrated circuits, transistors (triodes, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on it. The following is about 24 Layers of Any Connected HDI related, I hope to help you better understand 24 Layers of Any Connected HDI.
  • EP4SGX360KF40C4G

    EP4SGX360KF40C4G

    EP4SGX360KF40C4G Hongtai Quick Electronics is 100% in stock with a complete range of products. We only offer original products with a 15 year reputation, providing a safe and reliable electronic component procurement platform
  • 10AX090U2F45E2SG

    10AX090U2F45E2SG

    10AX090U2F45E2SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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