The development of printed circuit board substrate materials has gone through nearly 50 years. In addition, there were about 50 years of scientific experiments and Exploration on the basic raw materials used in this industry - resin and reinforcing materials. PCB substrate materials have accumulated a history of nearly 100 years. The development of substrate material industry at each stage is driven by the innovation of electronic whole machine products, semiconductor manufacturing technology, electronic installation technology and electronic circuit manufacturing technology. From the beginning of the 20th century to the end of the 1940s, it was the embryonic stage of the development of PCB substrate material industry. Its development characteristics are mainly reflected in: at this time, a large number of resins, reinforcing materials and insulating substrates for substrate materials have emerged, and the technology has been preliminarily explored. All these have created necessary conditions for the emergence and development of copper clad laminate, the most typical substrate material for printed circuit board. On the other hand, PCB manufacturing technology with metal foil etching (subtraction) as the mainstream has been initially established and developed. It plays a decisive role in determining the structural composition and characteristic conditions of copper clad laminate.
Copper clad laminate was really adopted on a large scale in PCB production, which first appeared in the PCB industry in the United States in 1947. PCB substrate material industry has also entered its initial stage of development. At this stage, the manufacturing technology progress of raw materials used in the manufacture of substrate materials - organic resin, reinforcement materials, copper foil, etc. has given a strong impetus to the progress of substrate material industry. Because of this, the substrate material manufacturing technology began to mature step by step.
PCB substrate - copper clad laminate
The invention and application of integrated circuits and the miniaturization and high-performance of electronic products push the PCB substrate material technology onto the track of high-performance development. With the rapid expansion of the demand for PCB products in the world market, the output, variety and technology of PCB substrate material products have developed at a high speed. At this stage, there is a broad new field in the application of substrate materials - multilayer printed circuit board. At the same time, at this stage, the structural composition of substrate materials has further developed its diversification. In the late 1980s, portable electronic products represented by notebook computers, mobile phones and small video cameras began to enter the market. These electronic products are rapidly developing towards miniaturization, lightweight and multi-function, which has greatly promoted the progress of PCB towards micro pores and micro wires. Under the above changes in PCB market demand, a new generation of multilayer board that can realize high-density wiring - laminated multilayer board (bum) came out in the 1990s. The breakthrough of this important technology also makes the substrate material industry enter a new stage of development dominated by substrate materials for high density interconnect (HDI) multilayer boards. In this new stage, the traditional copper clad laminate technology is facing new challenges. PCB substrate materials have made new changes and innovations in manufacturing materials, production varieties, organizational structure and performance characteristics of substrates, as well as product functions.
Relevant data show that the output of rigid copper clad laminates in the world increased at an average annual rate of about 8.0% in the 12 years from 1992 to 2003. In 2003, the total annual output of rigid copper clad laminate in China has reached 105.9 million square meters, accounting for about 23.2% of the global total. The sales revenue reached US $6.15 billion, the market capacity reached 141.7 million square meters, and the production capacity reached 155.8 million square meters. All these show that China has become a "superpower" in the manufacturing and consumption of copper clad laminates in the world
