XC7K160T-2FFG676I Manufacturers

Our firm insists all along the quality policy of "product high quality is base of organization survival; consumer fulfillment could be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" along with the consistent purpose of "reputation 1st, purchaser first" for XC7K160T-2FFG676I,Chip,Microcircuit,IC,Electronic components, With us your money in risk-free your company in safe and sound . Hope we are able to be your trustworthy supplier in China . Seeking forward for your cooperation .
XC7K160T-2FFG676I, we rely on own advantages to build a mutual-benefit commerce mechanism with our cooperative partners. As a result, we have gained a global sales network reaching the Middle East, Turkey, Malaysia and Vietnamese.

Hot Products

  • PC28F00AP30TF

    PC28F00AP30TF

    PC28F00AP30TF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-3CSG484C

    XC6SLX45-3CSG484C

    XC6SLX45-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX290NF45C3N

    EP4SGX290NF45C3N

    EP4SGX290NF45C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 6 layers ELIC HDI PCB

    6 layers ELIC HDI PCB

    Any Layer Inner Via Hole,The arbitrary interconnection between layers can meet the wiring connection requirements of high-density HDI boards. Through the setting of thermally conductive silicone sheets, the circuit board has good heat dissipation and shock resistance.The following is about 6 layers ELIC HDI PCB, I hope to help you better understand 6 layers ELIC HDI PCB.
  • LTC6804IG-1#TRPBF

    LTC6804IG-1#TRPBF

    LTC6804IG-1#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K70T-2FBG676C

    XC7K70T-2FBG676C

    XC7K70T-2FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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