XC4VFX40-11FFG1152I Manufacturers

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XC4VFX40-11FFG1152I, now we have 8 years experience of production and 5 years experience in trading with the customers all over the world. our clients mainly distributed in the North America, Africa and Eastern Europe. we can supply high quality items with the very competitive price.

Hot Products

  • XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM89811B1AWMLGT

    BCM89811B1AWMLGT

    BCM89811B1AWMLGT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD96685BRZ

    AD96685BRZ

    AD96685BRZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Robot PCB

    Robot PCB

    The heat resistance of the Robot PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • BCM63148VKFSBG

    BCM63148VKFSBG

    BCM63148VKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-3210PCIF

    HI-3210PCIF

    The HI-3210PCIF is a highly integrated data management engine designed specifically for ARINC 429 communication. It features eight ARINC 429 receive channels and four ARINC 429 transmit channels, enabling efficient data transfer between avionics systems

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