XC2V3000-6BG728C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • EP2AGX95EF29C5N

    EP2AGX95EF29C5N

    EP2AGX95EF29C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • CDCLVD1204RGTR

    CDCLVD1204RGTR

    CDCLVD1204RGTR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX75T-2FFG484I

    XC6VLX75T-2FFG484I

    XC6VLX75T-2FFG484I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include rich logical units and I/O resources
  • XCVU13P-1FLGA2577E

    XCVU13P-1FLGA2577E

    ​XCVU13P-1FLGA2577E is an FPGA (Field Programmable Gate Array) product launched by Xilinx. This product belongs to the UltraScale+architecture, designed to meet a wide range of system requirements, with a particular focus on reducing total power consumption through multiple innovative technologies
  • XC4VLX40-10FFG1148I

    XC4VLX40-10FFG1148I

    XC4VLX40-10FFG1148I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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