TPS22975DSGR Manufacturers

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TPS22975DSGR, We hope to have long-term cooperation relationships with our clients. If you are interested in any of our items, be sure to do not hesitate to send enquiry to us/company name. We ensure that you can be totally satisfied with our best solutions!

Hot Products

  • S1000-2M PCB

    S1000-2M PCB

    S1000-2M PCB is made of S1000-2M material with TG value of 180. It is a good choice for Multilayer PCB with high reliability, high cost performance, high performance, stability and practicality
  • XCKU3P-1FFVB676I

    XCKU3P-1FFVB676I

    XCKU3P-1FFVB676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX75-2FGG484C

    XC6SLX75-2FGG484C

    ​XC6SLX75-2FGG484C The platform's components support up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
  • TPS4H160AQPWPRQ1

    TPS4H160AQPWPRQ1

    TPS4H160AQPWPRQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56864A1IFSBG

    BCM56864A1IFSBG

    BCM56864A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-1FFVA2104I

    XCVU095-1FFVA2104I

    ​XCVU095-1FFVA2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale architecture series. This chip is packaged in FCBGA 2104 and features high-performance FPGA logic that can be configured as distributed memory. It has 36Kb dual port block RAM and built-in FIFO logic for on-chip data bufferin

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