TG170 PCB Manufacturers

Fast and fantastic quotations, informed advisers to help you choose the correct products that suits all your needs, a short manufacturing time, responsible good quality control and distinct companies for paying and shipping affairs for TG170 PCB,8MM thick PCB,SH260 high heat-resistant PCB,Synamic 6N Ultra Low Loss PCB,Synamic 6N PCB, Currently, we're seeking ahead to even bigger cooperation with abroad customers according to mutual gains. Please experience free of charge to get in touch with us for more specifics.
TG170 PCB, With good quality, reasonable price and sincere service, we enjoy a good reputation. Products are exported to South America, Australia, Southeast Asia and so on. Warmly welcome customers at home and abroad to cooperate with us for the brilliant future.

Hot Products

  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MT40A1G8SA-062E:E

    MT40A1G8SA-062E:E

    MT40A1G8SA-062E:E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S50-4PQG208C

    XC3S50-4PQG208C

    XC3S50-4PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C10F256I7N

    EP3C10F256I7N

    EP3C10F256I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-2FF900I

    XC7K325T-2FF900I

    ​XC7K325T-2FF900I FPGA integrated circuit XC7K325T-2F900I 640MHz Kintex-7 FPGA chip 900-FCBGA
  • BCM68621B0IFSBG

    BCM68621B0IFSBG

    BCM68621B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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