RO3010 high frequency microwave PCB Manufacturers

The incredibly rich projects administration experiences and a person to 1 service model make the substantial importance of organization communication and our easy understanding of your expectations for RO3010 high frequency microwave PCB,Ro4003CLoPro high frequency circuit board,RO4360G2 low loss high frequency PCB,Ro4003CLoPro PCB,Ro4003CLoPro high frequency PCB, We honor our core principal of Honesty in company, priority in service and will do our best to provide our buyers with high-quality products and solutions and great support.
RO3010 high frequency microwave PCB, We attained ISO9001 which provides solid foundation for our further development. Persisting in "High quality, Prompt Delivery, Competitive Price", now we have established long-term cooperation with clients from both overseas and domestically and get new and old clients' high comments. It is our great honor to meet your demands. We have been sincerely expecting your attention.

Hot Products

  • EP3SE50F780I3N

    EP3SE50F780I3N

    EP3SE50F780I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5M160ZT100C5N

    5M160ZT100C5N

    5M160ZT100C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVB2104E

    XCVU7P-2FLVB2104E

    ​XCVU7P-2FLVB2104E is a Field Programmable Gate Array (FPGA) developed by Xilinx, packaged in BGA-2104 format. This FPGA belongs to Virtex ™ The UltraScale+series, designed on 14nm/16nm FinFET nodes, provides high-performance and highly integrated functionality.
  • BCM54616SC0IFBG

    BCM54616SC0IFBG

    BCM54616SC0IFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX550T-1FFG1760I

    XC6VLX550T-1FFG1760I

    ​XC6VLX550T-1FFG1760I is an FPGA chip produced by Xilinx, belonging to the field programmable gate array (FPGA) series. FPGA is a programmable logic device that allows users or designers to reconfigure circuits after manufacturing is completed. The XC6VLX550T-1FFG1760I chip adopts advanced BGA packaging
  • XC4VSX35-11FF668C

    XC4VSX35-11FF668C

    ​XC4VSX35-11FF668C is a Virtex-4 series FPGA chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include supporting rich logical units and I/O resources,

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