RF PCB Manufacturers

We always believe that one's character decides products' quality, the details decides products' quality ,with the REALISTIC,EFFICIENT AND INNOVATIVE team spirit for RF PCB,22Layer RF PCB,TU-752 PCB,High-speed PCB,Rogers PCB, We are generally looking ahead to forming effective business associations with new clientele around the world.
RF PCB, We warmly welcome your patronage and will serve our clients both at home and abroad with items of superior quality and excellent service geared to the trend of further development as always. We believe you will benefit from our professionalism soon.

Hot Products

  • XC7A75T-L2FGG484E

    XC7A75T-L2FGG484E

    XC7A75T-L2FGG484E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CEFA7U19I7N

    5CEFA7U19I7N

    ​5CEFA7U19I7N is an FPGA field programmable logic device, and Cyclone ® V devices can simultaneously meet the requirements of decreasing power consumption, cost, and time to market, as well as the increasing bandwidth requirements of large-scale and cost sensitive applications.
  • Multilayer layers HDI PCB

    Multilayer layers HDI PCB

    Multilayer layers HDI PCB, press 3-6 layers first, then add 2 and 7 layers, and finally add 1 to 8 layers, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • EP3C10E144I7N

    EP3C10E144I7N

    ​EP3C10E144I7N FPGA Field Programmable Logic Device Altera Packaging Original Factory Packaging Batch 22+
  • XC7K410T-2FFG676I

    XC7K410T-2FFG676I

    XC7K410T-2FFG676I provides the best cost-effectiveness and low power consumption for rapidly growing applications and wireless communication. The Kindex-7 FPGA boasts excellent performance and connectivity, priced at the same level as previously limited to the highest capacity applications.
  • BCM49418B0KFEBG

    BCM49418B0KFEBG

    BCM49418B0KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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