N9300-13 RF PCB Manufacturers

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Hot Products

  • XC3S700A-4FTG256C

    XC3S700A-4FTG256C

    XC3S700A-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU35P-2FSVH2104E

    XCVU35P-2FSVH2104E

    ​XCVU35P-2FSVH2104E is an FPGA chip from Xilinx, belonging to the Virtex series. This chip has the following characteristics and specifications:
  • XCVU7P-L2FLVA2104E

    XCVU7P-L2FLVA2104E

    XCVU7P-L2FLVA2104E is a Virtex UltraScale+ FPGA chip from Xilinx, a leading provider of programmable logic solutions. This chip is part of Xilinx's high-performance Virtex UltraScale+ series and features 2.7 million logic cells and 3,780 DSP slices.
  • XC7A15T-1CPG236I

    XC7A15T-1CPG236I

    XC7A15T-1CPG236I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Medical Equipment PCB

    Medical Equipment PCB

    HDI imaging, while achieving low defect rate and high output, can achieve stable production of HDI conventional high-precision operation. For example: advanced mobile phone board, CSP pitch is less than 0.5mm. The board structure is 3 + n + 3, there are three superposed vias on each side, and 6 to 8 layers of coreless printed boards with superimposed vias.The following is about Medical Equipment PCB related, I hope to help you better understand Medical Equipment PCB.
  • BCM57416B1KFSBG

    BCM57416B1KFSBG

    BCM57416B1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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