Panasonic M7 PCB Manufacturers

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Hot Products

  • XCKU115-3FLVF1924E

    XCKU115-3FLVF1924E

    The XCKU115-3FLVF1924E field programmable gate array can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • XC5VSX95T-2FFG1136C

    XC5VSX95T-2FFG1136C

    XC5VSX95T-2FFG1136C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ISOLA FR408 High Frequency PCB

    ISOLA FR408 High Frequency PCB

    For general frequency, use FR-4 sheet, but high-frequency materials should be used in the frequency ratio of 1-5G, such as semi-ceramic materials. ROGERS 4350, 4003, 5880, etc. are commonly used ... If the frequency is higher than 5G, it is best to use PTFE material, which is polytetrafluoroethylene. This material has good high-frequency performance, but there are limitations in the processing arts, such as the surface technology that cannot be hot air leveled. The following is about ISOLA FR408 High Frequency PCB related, I hope to help you better understand ISOLA FR408 High Frequency PCB.
  • XC6SLX100T-3CSG484C

    XC6SLX100T-3CSG484C

    XC6SLX100T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC4VLX40-10FFG1148I

    XC4VLX40-10FFG1148I

    XC4VLX40-10FFG1148I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150-3FGG676I

    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement

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