NY9000 PCB Manufacturers

To be a result of ours specialty and repair consciousness, our corporation has won a good popularity amid consumers everywhere in the environment for NY9000 PCB,N7000-1 PCB,N7000-3 PCB,N7000-2HT PCB,NX9000 PCB, We welcome an prospect to do small business along with you and hope to have pleasure in attaching further particulars of our merchandise.
NY9000 PCB, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our goods are favored by domestic and foreign customers. With your support, we are going to build a better tomorrow!

Hot Products

  • XC7K410T-3FFG900E

    XC7K410T-3FFG900E

    ​XC7K410T-3FFG900E is a user configurable analog interface (XADC) that integrates dual 12 bit 1MSPS analog-to-digital converters with on-chip thermal and power sensors.
  • 5G Optical Module PCB

    5G Optical Module PCB

    10G SFP+ LR is a high performance, cost effective modules, which is supporting Multi Rate 2.4576Gbps to 10.3125Gbps, and transmission distance up to 10km on SM fiber. The transceiver consists of two sections: The transmitter section incorporates a laser driver and a 1310nm DFB laser.The following is about 5G Optical Module PCB related, I hope to help you better understand 5G Optical Module PCB.
  • XC6VLX550T-2FFG1759C

    XC6VLX550T-2FFG1759C

    XC6VLX550T-2FFG1759C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, which belongs to the LXT sub series of the Virtex-6 series. Here is a detailed introduction to the chip:
  • EP3SE110F1152I3N

    EP3SE110F1152I3N

    EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A200T-2SBG484C

    XC7A200T-2SBG484C

    ​XC7A200T-2SBG484C is a high-performance FPGA chip produced by Xilinx. This chip plays a crucial role in multiple application scenarios due to its powerful functionality and flexibility. Here are some detailed introductions about XC7A200T-2SBG484C:
  • XCKU3P-1FFVD900E

    XCKU3P-1FFVD900E

    ​XCKU3P-1FFVD900E is an FPGA chip launched by Xilinx, belonging to the Kintex UltraScale+series. This chip adopts a 20 nanometer process and has highly integrated characteristics, which can be widely used in high-performance computing, video processing

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