High Density Interconnect PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for High Density Interconnect PCB,VT-870 PCB,20-layer 6step HDI PCB,24layer 4step HDI PCB, Adhering on the company principle of mutual gains, we have won superior popularity amid our shoppers because of our excellent products and services, excellent products and aggressive selling prices. We warmly welcome shoppers from home and overseas to cooperate with us for common achievements.
High Density Interconnect PCB, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Hot Products

  • XC6SLX4-3TQG144C

    XC6SLX4-3TQG144C

    XC6SLX4-3TQG144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5M160ZT100I5N

    5M160ZT100I5N

    5M160ZT100I5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU2CG-1SBVA484E

    XCZU2CG-1SBVA484E

    ​XCZU2CG-1SBVA484E is a SoC FPGA that is part of Xilinx's Zynq UltraScale+series. This FPGA integrates the ARM Cortex-A53 processor core, providing powerful processing capabilities and rich I/O interfaces,
  • BCM65551B1IFSBG

    BCM65551B1IFSBG

    BCM65551B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM1190KQMG

    BCM1190KQMG

    BCM1190KQMG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU47DR-2FFVE1156I

    XCZU47DR-2FFVE1156I

    ​XCZU47DR-2FFVE1156I Embedded System on Chip (SoC) is a single-chip adaptive RF platform that can meet current and future industry needs. The Zynq UltraScale+RFSoC series can support all frequency bands below 6GHz, meeting the critical requirements of next-generation 5G deployment. At the same time, it can also support direct RF sampling for 14 bit analog-to-digital converters (ADCs) with a sampling rate of up to 5GS/S and 14 bit analog-to-digital converters (DACs) with a sampling rate of 10 GS/S, both of which have an analog bandwidth of up to 6GHz.

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