Industry News

What are the application scenarios of HDI PCB?

2025-08-26

High-Density Interconnect (HDI) PCBs enable revolutionary advancements in electronics by packing intricate circuitry into compact designs. As a leader in HDI PCB manufacturing, HONTEC delivers demanding precision-edge solutions for industries demanding precision, reliability, and rapid innovation. With certifications including UL, SGS, and ISO9001, and streamlined logistics via UPS/DHL, we empower cutting clients across 28 countries. Below, we explore HDI PCB applications, technical specifications, and industry-specific benefits.

HDI PCB

Understanding HDI PCBs

HDI PCBs use micro-vias, blind/buried vias, and fine-line traces to achieve higher wiring density than traditional boards. This allows:

Miniaturization: Shrink device sizes by 40–60%.

Enhanced Performance: Reduce signal loss and cross-talk.

Multi-layer Integration: Support complex designs in constrained spaces.


Application Scenarios of HDI PCBs

A. Consumer Electronics

Smartphones/Tablets: Enables ultra-thin designs with multi-camera arrays and 5G modules.

Wearables: Powers compact health monitors and AR/VR headsets.

B. Medical Devices

Imaging Systems: MRI machines and portable ultrasound devices.

Implants: Cardiac monitors with biocompatible materials.

C. Automotive Electronics

ADAS: LiDAR sensors and autonomous control units.

Infotainment: High-resolution displays and connectivity hubs.

D. Aerospace & Defense

Avionics: Flight control systems with EMI shielding.

Satellite Comms: Lightweight, radiation-resistant boards.

E. Telecommunications

5G Infrastructure: Base stations and RF amplifiers.

Routers/Switches: High-speed data transmission.

F. Industrial Automation

Robotics: Motor controllers and sensor interfaces.

IoT Gateways: Edge-computing devices.



Parameter Standard Range Advanced Capability
Layer Count 4–20 layers Up to 30 layers
Minimum Trace/Space 3/3 mil (76.2 μm) 2/2 mil (50.8 μm)
Micro-Via Diameter 0.1 mm 0.075 mm
Board Thickness 0.4–3.0 mm 0.2–5.0 mm
Surface Finish ENIG, HASL, Immersion Silver OSP, Hard Gold
Material FR-4, High-Tg, Rogers Polyimide, Halogen-Free

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