High-Density Interconnect (HDI) PCBs enable revolutionary advancements in electronics by packing intricate circuitry into compact designs. As a leader in HDI PCB manufacturing, HONTEC delivers demanding precision-edge solutions for industries demanding precision, reliability, and rapid innovation. With certifications including UL, SGS, and ISO9001, and streamlined logistics via UPS/DHL, we empower cutting clients across 28 countries. Below, we explore HDI PCB applications, technical specifications, and industry-specific benefits.
HDI PCBs use micro-vias, blind/buried vias, and fine-line traces to achieve higher wiring density than traditional boards. This allows:
Miniaturization: Shrink device sizes by 40–60%.
Enhanced Performance: Reduce signal loss and cross-talk.
Multi-layer Integration: Support complex designs in constrained spaces.
A. Consumer Electronics
Smartphones/Tablets: Enables ultra-thin designs with multi-camera arrays and 5G modules.
Wearables: Powers compact health monitors and AR/VR headsets.
B. Medical Devices
Imaging Systems: MRI machines and portable ultrasound devices.
Implants: Cardiac monitors with biocompatible materials.
C. Automotive Electronics
ADAS: LiDAR sensors and autonomous control units.
Infotainment: High-resolution displays and connectivity hubs.
D. Aerospace & Defense
Avionics: Flight control systems with EMI shielding.
Satellite Comms: Lightweight, radiation-resistant boards.
E. Telecommunications
5G Infrastructure: Base stations and RF amplifiers.
Routers/Switches: High-speed data transmission.
F. Industrial Automation
Robotics: Motor controllers and sensor interfaces.
IoT Gateways: Edge-computing devices.
Parameter | Standard Range | Advanced Capability |
Layer Count | 4–20 layers | Up to 30 layers |
Minimum Trace/Space | 3/3 mil (76.2 μm) | 2/2 mil (50.8 μm) |
Micro-Via Diameter | 0.1 mm | 0.075 mm |
Board Thickness | 0.4–3.0 mm | 0.2–5.0 mm |
Surface Finish | ENIG, HASL, Immersion Silver | OSP, Hard Gold |
Material | FR-4, High-Tg, Rogers | Polyimide, Halogen-Free |