Products
Home > Products > EP3C55F780I7N

EP3C55F780I7N Manufacturers

We try for excellence, service the customers", hopes to be the most effective cooperation workforce and dominator company for staff, suppliers and shoppers, realizes price share and ongoing marketing for EP3C55F780I7N, Welcome any within your inquiries and concerns for our products and solutions, we glance ahead to setting up a long-term enterprise partnership along with you within the close to potential. get hold of us today.
EP3C55F780I7N, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Related Products

Hot Products

  • MT60B3G8RW-56B:B

    MT60B3G8RW-56B:B

    MT60B3G8RW-56B:B is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM81392B0IFSBG

    BCM81392B0IFSBG

    BCM81392B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Large size PCB

    Large size PCB

    Large size PCB super big size pcb-oil rig main board:board thickness 4.0mm, 4layer, L1-L2 blind hole, L3-L4 blind hole, 4/4/4/4oz copper, Tg170, single panel size 820*850mm. oil rig main board:board thickness 4.0mm, 4layer, L1-L2 blind hole, L3-L4 blind hole, 4/4/4/4oz copper, Tg170, single panel size 820*850mm.
  • XC7VX690T-L2FFG1930E

    XC7VX690T-L2FFG1930E

    XC7VX690T-L2FFG1930E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CSEMA6F31I7N

    5CSEMA6F31I7N

    5CSEMA6F31I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Definition and cause of pink circle on circuit board PCB

    After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.

  • The source of the name of the HDI Board

    HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.

  • Polar models flexible PCB enhanced resistance

    Now Si8000m and Si9000e also have a new option of XFE cross-modeling function, which Polar Instruments can provide. More than 98% of PCB manufacturers including Hongtai use Polar.​

  • Multilayer PCB Laminate Structure

    Before designing a multi-layer PCB circuit board, the designer needs to first determine the circuit board structure used according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC)

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • Definition of PCB

    PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.

Send Inquiry