EP2SGX30DF780C3N Manufacturers

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EP2SGX30DF780C3N, Over the years, with high-quality solutions, first- class service, ultra-low prices we win thee trust and favor of customers. Nowadays our products sell all over the domestic and abroad. Thanks for the regular and new customers support. We offer high quality product and competitive price, welcome the regular and new customers cooperate with us!

Hot Products

  • XC3S250E-5FTG256G

    XC3S250E-5FTG256G

    XC3S250E-5FTG256G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1S30F1020C5

    EP1S30F1020C5

    EP1S30F1020C5 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADN8834ACBZ

    ADN8834ACBZ

    ADN8834ACBZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A75T-2FGG484I

    XC7A75T-2FGG484I

    XC7A75T-2FGG484I is a field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 52,160 logic cells, 2.7 Mb of block RAM, and 240 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1000 MHz. The device comes in a fine-pitch ball grid array (FGG484I) package with 484 pins, providing high pin-count connectivity for a variety of applications. XC7A75T-2FGG484I is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for high-speed and high-reliability applications.
  • XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP4SGX530NF45I3N

    EP4SGX530NF45I3N

    EP4SGX530NF45I3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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