Cross blind buried via PCB Manufacturers

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Hot Products

  • MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
  • XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I Field Programmable Gate Array (FPGA) is a device that utilizes stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Virtex-7 is suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • MAX13082EESA+

    MAX13082EESA+

    MAX13082EESA+ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Large size HDI PCB

    Large size HDI PCB

    The buried hole is not necessarily HDI. Large size HDI PCB first-order and second-order and third-order how to distinguish the first-order is relatively simple, the process and process are easy to control. Second order began to trouble, one is the problem of alignment, a hole and copper plating problem.
  • TMS3705GDRQ1

    TMS3705GDRQ1

    TMS3705GDRQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LMH0340SQE/NOPB

    LMH0340SQE/NOPB

    LMH0340SQE/NOPB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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