BCM81394B0IFSBG Manufacturers

With our prosperous working experience and thoughtful solutions, now we have been regarded to be a dependable supplier for lots of intercontinental prospective buyers for BCM81394B0IFSBG, We sincerely welcome friends to negotiate business and start cooperation. We hope to join hands with friends in different industries to create a brilliant future.
BCM81394B0IFSBG, Our company, is always regarding quality as company' s foundation, seeking for development via high degree of credibility , abiding by iso9000 quality management standard strictly , creating top-ranking company by spirit of progress-marking honesty and optimism.

Hot Products

  • BCM65300IFEBG

    BCM65300IFEBG

    BCM65300IFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LT6203IMS8#PBF

    LT6203IMS8#PBF

    LT6203IMS8#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • XC7K70T-1FBG484I

    XC7K70T-1FBG484I

    ​XC7K70T-1FBG484I is widely used in communication infrastructure, wired/wireless communication systems, video and image processing, industrial control and automation systems, aerospace and defense electronics, testing and measurement instruments, and other fields. It provides rich logic resources, DSP resources, and high-speed serial interfaces to meet the demanding performance requirements of various mid to high end FPGA applications.
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • 10M50DAF484I7G

    10M50DAF484I7G

    10M50DAF484I7G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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