BCM54216EB1KMLG Manufacturers

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Hot Products

  • XC7S75-2FGGA676C

    XC7S75-2FGGA676C

    ​XC7S75-2FGGA676C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Spartan-7 series. This chip has the following features and specifications:
  • XCVU160-1FLGB2104I

    XCVU160-1FLGB2104I

    XCVU160-1FLGB2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU060-2FFVA1517I

    XCKU060-2FFVA1517I

    ​XCKU060-2FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • XC7K410T-3FFG900E

    XC7K410T-3FFG900E

    ​XC7K410T-3FFG900E is a user configurable analog interface (XADC) that integrates dual 12 bit 1MSPS analog-to-digital converters with on-chip thermal and power sensors.
  • XCZU3CG-1SFVC784E

    XCZU3CG-1SFVC784E

    XCZU3CG-1SFVC784E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SL200H780C5

    EP3SL200H780C5

    EP3SL200H780C5 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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