BCM49418B0KFEBG Manufacturers

With superior technologies and facilities, strict quality command, reasonable cost, exceptional provider and close co-operation with customers, we've been devoted to delivering the best benefit for our buyers for BCM49418B0KFEBG, We sincerely welcome friends to barter business enterprise and start cooperation with us. We hope to hitch hands with close friends in different industries to produce a brilliant long run.
BCM49418B0KFEBG, With high quality, reasonable price, on-time delivery and customized & customized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Hot Products

  • 10M02SCU169C8G

    10M02SCU169C8G

    ​10M02SCU169C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip has non-volatile characteristics, built-in dual configuration flash memory and user flash memory, and supports instant configuration. It integrates an analog-to-digital converter (ADC) and a single-chip Nios II soft core processor, suitable for various applications such as system management, I/O expansion, and storage
  • DS3231MZ+TRL

    DS3231MZ+TRL

    DS3231MZ+TRL is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX290NF45C3N

    EP4SGX290NF45C3N

    EP4SGX290NF45C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • RO3010 PCB

    RO3010 PCB

    RO3010 PCB Laminate twice. Take an eight-layer circuit board with blind/buried vias as an example. First, laminate layers 2-7, first make elaborate blind/buried vias, and then laminate layer 1 and 8 layers to make well-made vias .The following is about6 layers 2Step HDI, I hope to help you better understand RO3010 PCB
  • XC2VP40-5FF1152I

    XC2VP40-5FF1152I

    XC2VP40-5FF1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XA6SLX45-2CSG324Q

    XA6SLX45-2CSG324Q

    XA6SLX45-2CSG324Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry