Batch: 2023+ Manufacturers

We have now a specialist, efficiency staff to provide good quality company for our consumer. We normally follow the tenet of customer-oriented, details-focused for Batch: 2023+,Model: XCVU9P-2FLGB2104I,Brand: xilinx Operating temperature: -40℃ ~ 100℃ Number of stitches: 2104,Quantity: 320pcs, should you may have any query or wish to place an initial purchase be sure to never hesitate to contact us.
Batch: 2023+, With excellent merchandise, high quality service and sincere attitude of service, we ensure customer satisfaction and help customers create value for mutual benefit and create a win-win situation. Welcome customers all over the world to contact us or visit our company. We are going to satisfy you with our expert service!

Hot Products

  • XC7K410T-2FBG900I

    XC7K410T-2FBG900I

    XC7K410T-2FBG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU6CG-2FFVC900I

    XCZU6CG-2FFVC900I

    XCZU6CG-2FFVC900I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA belongs to the Zynq UltraScale+ MPSoC (Multiprocessor System on Chip) family and has 62,500 System Logic Cells, operates at a speed of up to 1 GHz, and features a 6-Input Processor System (PS), 40 Mb of UltraRAM, 900 Kbyte of Block RAM, and 192 DSP Slices.
  • XCVU5P-1FLVB2104I

    XCVU5P-1FLVB2104I

    ​XCVU5P-1FLVB2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale+series. This chip integrates up to 1.5 million system logic units and utilizes second-generation 3D integrated circuit technology to integrate multiple PCI Express Gen3 cores, improving system performance
  • XC7VX980T-1FFG1926I

    XC7VX980T-1FFG1926I

    XC7VX980T-1FFG1926I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-3FLVC2104E

    XCVU7P-3FLVC2104E

    ​XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate,
  • XC7A35T-2CSG324I

    XC7A35T-2CSG324I

    XC7A35T-2CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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