14-layer Enterprise SSD Rigid-Flex PCB Manufacturers

Assume full accountability to meet all requires of our purchasers; realize continual advancements by selling the advancement of our customers; grow to be the final permanent cooperative partner of consumers and maximize the interests of clientele for 14-layer Enterprise SSD Rigid-Flex PCB,16-layer 2step HDI Rigid-Flex PCB,2step HDI Rigid-Flex PCB,Rigid-Flex PCB,SSD Rigid Flex PCB, Never-ending improvement and striving for 0% deficiency are our two main quality policies. Should you need anything, don't hesitate to contact us.
14-layer Enterprise SSD Rigid-Flex PCB, Our company promises: reasonable prices, short production time and satisfactory after-sales service, we also welcome you to visit our factory at any time you want. Wish we have a pleasant and long terms business together!!!

Hot Products

  • 8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB is pressed 3-6 layers first, then 2 and 7 layers are added, and finally 1 to 8 layers are added, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM54213PEB1KMLGT

    BCM54213PEB1KMLGT

    BCM54213PEB1KMLGT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX195T-2FFG784I

    XC6VLX195T-2FFG784I

    XC6VLX195T-2FFG784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S250E-4FTG256C

    XC3S250E-4FTG256C

    XC3S250E-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry