XCZU4EV-2FBVB900I Manufacturers

Dependable high-quality and good credit rating standing are our principles, which will help us at a top-ranking position. Adhering into the tenet of "quality first, consumer supreme" for XCZU4EV-2FBVB900I, To learn more about what we can do for you, contact us at any time. We look forward to establishing good and long-term business relationships with you.
XCZU4EV-2FBVB900I, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Hot Products

  • HI-3584APQT-15

    HI-3584APQT-15

    ​The features of HI-3584APQT-15 include ARINC 429 compatibility, high-speed 3.3V logic interface, offering 9mm x 9mm small chip level packaging, and dual receiver and transmitter interfaces. ‌
  • XCVU9P-L2FLGB2104E

    XCVU9P-L2FLGB2104E

    ​XCVU9P-L2FLGB2104E is a high-performance FPGA chip in Xilinx's Virtex UltraScale+series. The chip adopts advanced 28 nanometer high-K metal gate (HKMG) technology, combined with stacked silicon interconnect (SSI) technology, to achieve a perfect combination of low power consumption and high performance
  • EP4SGX230KF40C4N

    EP4SGX230KF40C4N

    EP4SGX230KF40C4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-1FLGC2104E

    XCVU11P-1FLGC2104E

    ​The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node.
  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
  • Power amplifier PCB

    Power amplifier PCB

    Power amplifier PCB-The role of the power amplifier is to amplify the weak signal from the sound source or pre-amplifier, and promote the speaker to play sound. The function of a good sound system amplifier is indispensable.The following is about Microwave circuit board related, I hope to help you better understand Microwave circuit board.

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