XCVU9P-1FLGA2577I Manufacturers

Our rewards are lessen selling prices,dynamic sales team,specialized QC,solid factories,high quality services for XCVU9P-1FLGA2577I, "Making the Merchandise of Significant Quality" could be the eternal goal of our firm. We make unremitting endeavours to know the aim of "We Will Always Keep in Pace using the Time".
XCVU9P-1FLGA2577I, Our advantages are our innovation, flexibility and reliability which have been built during last 20 years. We focus on providing service for our clients as a key element in strengthening our long-term relationships. The continual availability of high grade products and solutions in combination with our excellent pre- and after-sales service ensures strong competitiveness in an increasingly globalized market.

Hot Products

  • EP4SGX230HF35C4G

    EP4SGX230HF35C4G

    This chip provides 230K logic units and integrates multiple high-speed communication interfaces such as PCIe 2.0 x8, high-speed serial connectors DDR3 memory controller, etc. The chip adopts manufacturing technology based on the 40 nanometer process, which has advantages such as efficient processing capacity, low power EP4SGX230HF35C4G consumption, and low cost. This chip has a wide range of applications in high-performance computing, network communication, video transcoding, and image processing.
  • 10M08SCU169C8G

    10M08SCU169C8G

    10M08SCU169C8G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SL200F1152I3N

    EP3SL200F1152I3N

    ​EP3SL200F1152I3N is an FPGA (Field Programmable Gate Array) chip produced by Altera, belonging to the Stratix III series. This chip has the following characteristics and specifications
  • 2Step HDI PCB

    2Step HDI PCB

    According to the use of high-end HDI board-3G board or IC carrier board, its future growth is very rapid: the world's 3G mobile phone growth will exceed 30% in the next few years, China will soon issue 3G licenses; IC carrier board industry consulting agency Prismark predicts China's forecasted growth rate from 2005 to 2010 is 80%, which represents the development direction of PCB technology. The following is about 2Step HDI PCB related, I hope to help you better understand 2Step HDI PCB.
  • 10AX115N4F40E3SG

    10AX115N4F40E3SG

    10AX115N4F40E3SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1K50QC208-3N

    EP1K50QC208-3N

    EP1K50QC208-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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