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    In PCB proofing, a layer of copper foil is bonded to the outer layer of FR-4. When the copper thickness is = 8oz, it is defined as a 8OZ heavy copper pcb. The 8OZ heavy copper pcb has excellent extension performance, high temperature, low temperature, and corrosion resistance, which allows electronic equipment products to have a longer service life, and also greatly helps the size of electronic equipment to be simplified. In particular, electronic products that need to run higher voltages and currents require 8OZ heavy copper pcb.
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    XCVU13P-3FHGC2104E

    ​XCVU13P-3FHGC2104E Virtex™ UltraScale+ ™ As the most powerful FPGA series in the industry, UltraScale+devices are the perfect choice for computationally intensive applications, ranging from 1+Tb/s networks, machine learning to radar/warning systems.
  • BCM89200BBQLEG

    BCM89200BBQLEG

    BCM89200BBQLEG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM6710A1KFFBG

    BCM6710A1KFFBG

    BCM6710A1KFFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K70T-2FBG676I

    XC7K70T-2FBG676I

    XC7K70T-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z045-1FFG900I

    XC7Z045-1FFG900I

    ​XC7Z045-1FFG900I is a Zynq-7000 series System on a Chip (SoC) product produced by Xilinx. This chip has the following characteristics and specifications:
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