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XCKU3P-1FFVB676E Manufacturers

The client satisfaction is our primary concentrate on. We uphold a consistent level of professionalism, top quality, credibility and service for XCKU3P-1FFVB676E, To significantly improve our assistance quality, our company imports a large number of international advanced devices. Welcome clients from your home and abroad to simply call and inquire!
XCKU3P-1FFVB676E, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

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  • 10AX115H3F34I2SG

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    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
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    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding

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    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

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