High speed board can be seen from practice that the development of IC chip is that the chip volume is smaller and smaller and the number of pins is more and more from the perspective of packaging form. At the same time, due to the development of IC process in recent years, its speed is higher and higher. It can be seen that in today's rapidly developing field of electronic design, the electronic system composed of IC chips is developing rapidly in the direction of large-scale, small volume and high speed, and the development speed is faster and faster. This brings a problem, that is, the reduction of the volume of electronic design leads to the increase of the layout and wiring density of the circuit, while the frequency of the signal is still increasing, so how to deal with the problem of high-speed signal has become a key factor for the success of the design. With the rapid improvement of logic and system clock frequency in electronic system and the steepening of signal edge, the influence of trace interconnection and board layer characteristics of printed circuit board on the electrical performance of the system is becoming more and more important. For low-frequency design, the influence of trace interconnection and board layer can not be considered. When the frequency exceeds 50MHz, the interconnection relationship must be considered with the transmission line, and the electrical parameters of printed circuit board must also be considered when evaluating the system performance. Therefore, the design of high-speed system must face the timing problems caused by interconnection delay and signal integrity problems such as crosstalk and transmission line effect.(high speed board)
