Products
Home > Products > XC7VX550T-3FFG1158E

XC7VX550T-3FFG1158E Manufacturers

Just about every member from our large efficiency income crew values customers' wants and enterprise communication for XC7VX550T-3FFG1158E, The concept of our organization is "Sincerity, Speed, Provider, and Satisfaction". We are going to follow this concept and earn more and more customers' satisfaction.
XC7VX550T-3FFG1158E, Most problems between suppliers and clients are due to poor communication. Culturally, suppliers can be reluctant to question points they do not understand. We break down those barriers to ensure you get what you want to the level you expect, when you want it. Faster delivery time and the product you want is our Criterion .

Related Products

Hot Products

  • XC5VLX85T-1FFG1136C

    XC5VLX85T-1FFG1136C

    XC5VLX85T-1FFG1136C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CGXFC7D6F3117N

    5CGXFC7D6F3117N

    5CGXFC7D6F3117N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD620BR

    AD620BR

    AD620BR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A200T-2FFG1156C

    XC7A200T-2FFG1156C

    XC7A200T-2FFG1156C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Advantages and disadvantages of Flex-Rigid PCB

    The flexible circuit board is rolled with copper and similar materials, and the main goal is to provide sufficient flexibility and bending resistance. On the other hand, flexible rigid PCBs are constructed using a combination of two technologies and have flexible and rigid areas.

  • PCB proofing layout setting skills

    PCB proofing, as a component of high-precision electronic products, has been a very common existence in life. However, we all know that domestic professional PCB proofing design needs different point settings in different stages, and large grid points will be used for device layout in the layout stage. Let's take a look at the detailed PCB proofing layout setting skills.

  • Why HDI PCB needs to be browned and what is its function？

    We all know that there are many procedures for making HDI PCB from the planned feeding to the final step. One of the processes is called browning. Some people may ask what is the role of browning?

  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

  • Welding process of FPC circuit board

    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding

  • What is semiconductor?

    The semiconductor industry is one of the key industries supported by the state and one of the most critical "bottleneck" industries. What is semiconductor?

Send Inquiry